RF and microwave PCB projects pass starting functional testing but face some performance instability for high-frequency validation, volume manufacturing, or long-term working features. Common issues are: Excessive insertion loss Abnormal return loss Impedance mismatch Signal reflection EMI and crosstalk Ground discontinuity High-frequency loss caused by via transition RF performance drift after thermal cycling The main […]
Printed Circuit Board (PCB) assembly is the heart of modern electronic product manufacturing. Two primary methodologies dominate PCB assembly: Surface Mount Technology (SMT) and Through-Hole Technology (THT). Each technology has unique characteristics, advantages, limitations, and ideal use cases. This article presents a detailed, side-by-side examination of SMT and THT, covering fundamentals, process steps, component types, […]